The signature of today’s advanced technology – whether it’s autonomous vehicles, 5G-enabled devices, sensors creating an internet of things, or home routers – is high-speed, high-volume data transfer in increasingly dense packages. It poses new and unprecedented signal interference and heat dissipation challenges for design engineers worldwide.

New products operate at higher frequencies and use more powerful ICs/SOCs to facilitate enhanced data transfer and capabilities. Therefore, these electronics generate an even higher potential for a significant amount of electromagnetic signal interference. But EMI is only one part of the problem. More components make electronics more powerful, but also hotter, thus increasing the need for fast, reliable heat dissipation. Don’t forget about increasing needs for mechanical and environmental durability, space constraints, and lightweight designs. Enclosures are not just simple, aesthetic housing. They are functional, essential parts helping to address EMI and thermal challenges while protecting devices and systems from potentially harsh environments.

Design engineers face a quandary: How do I effectively solve both signal interference and heat dissipation challenges in tight (and shrinking) spaces?

Laird´s new Integrated Solutions portfolio addresses these multifaceted challenges with a unique range of multifunctional products and solutions – from electrically conductive fabrics to board level shield covers with thermal transfer capabilities. Combining our decades-long wealth of expertise in EMI products, precision metals, RF absorber and thermal solutions – with the latest material and manufacturing innovations – sparked a new way of thinking and has resulted in a plethora of value-add solutions. Significantly reducing your total cost of ownership and maintaining premium performance while lowering design iteration efforts is Laird´s driver for ISE (your Integrated Solutions Engineered).

Laird ISE is your one-stop-shop: from simulations/modeling to co-engineering, co-designing and high-quality manufacturing. Challenge us to trust us.

Explore Solutions:

• Metal-ISE:

Thermally and electro-magnetically enhanced die-cast, stamped, deep-drawn precision metal parts at board level (e.g. board level shields and RF absorbers) or subassembly level (e.g. automotive heatsinks).

• Structur-ISE:

Highly durable mechanically stable solutions at enclosure and I/O interface level (e.g. radomes, using state-of-the-art injection molding or forming capabilities).

• Hybrid-ISE:

Homogeneous single layer or heterogeneous multi-layer polymeric solutions offering multi-functional signal interference mitigation and heat dissipation (e.g. a thermally conductive RF absorber).

• Textil-ISE:

Electrically conductive fabrics enabling sensor, switch, and heating functionality (e.g. selectively plated stretch fabric).